Products

Aegis® H8202NLB is an unfilled, low/medium viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt fluidity for filling thin sections. It exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® H55C2ZP is a 2.7 RV, unfilled, medium viscosity, non-lubricated, polyamide 6/66 copolymer for molding or compounding. With a broad processing window and excellent melt fluidity for filling thin sections, it provides exceptional processability. Aegis® H55C2ZP resin combines strength, stiffness and toughness with chemical and abrasion resistance. For glass- or mineral-filled applications, Aegis® H55C2ZP resin also offers superior surface appearance and low warp.

Aegis® H35ZI is an unfilled, low viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt flow properties for filling thin sections and reduced cycle times. It exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® PIR-H8202NLB resin from AdvanSix contains 100% post-industrial recycled (PIR) raw materials while providing the same top performance and processability as Aegis® H8202NLB, its standard, non-recycled counterpart.Aegis® PIR-H8202NLB resin is an unfilled, low/medium viscosity, non-lubricated, nylon 6 homopolymer. It exhibits good strength, stiffness, and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® PIR-H35ZI resin from AdvanSix contains 100% post-industrial recycled (PIR) raw materials while providing the same top performance and processability as Aegis® H35ZI, its standard, non-recycled counterpart.Aegis® PIR-H35ZI resin is an unfilled, low viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt flow properties for filling thin sections and reduced cycle times. Aegis® PIR-H35ZI homopolymer exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.