Aegis® H55C2ZP is a 2.7 RV, unfilled, medium viscosity, non-lubricated, polyamide 6/66 copolymer for molding or compounding. With a broad processing window and excellent melt fluidity for filling thin sections, it provides exceptional processability. Aegis® H55C2ZP resin combines strength, stiffness and toughness with chemical and abrasion resistance. For glass- or mineral-filled applications, Aegis® H55C2ZP resin also offers superior surface appearance and low warp.

Polymer Name: Polyamide 6/66 (PA 6/66)

Processing Methods: Compounding, Extrusion, Extrusion Coating, Injection Molding

Technical Data Sheet

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Identification & Functionality

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Processing Guidelines

Material Handling

Maximum Water Content: 0.12%

Aegis® H55C2ZP copolyamide resin is supplied in sealed containers and drying prior to processing is not required. However, high moisture is the primary cause of processing issues. If drying becomes necessary, a dehumidifying or desiccant dryer operating at 80°C (176°F) is recommended. Drying time is dependent on moisture level.

Recommended Melt Temperature Range

Melt Temperature: Recommended range is 230-275°C (446-527°F)

Typical Extrusion Temperature Profile

Barrel: 239-256°C (462-493°F
Adapter: 250-256°C (482-493°F)
Die: 250-256°C (482-493°F)
Process Melt Temperature: 250-260°C (482-500°F)

Screw Parameters

Metering Section: 40%
Transition Section: 3 to 4 flights
Feed Section: Balance of screw length
Compression Ratio: 3.5:1 to 4.0:1
L/D Ratio: 24:1

Metering Section Flight Depth

Screw Diameter Recommended Depth
1" 0.055"
1.5" 0.060"
2" 0.070"
2.5" 0.080"
3.5" 0.100"
4.5" 0.115"
6" 0.135"


Typical Properties
ValueUnitsTest Method / Conditions
Extractablesmax. 0.8%SOP-702-307
FA Viscosity53D-789
Moisture Contentmax. 0.10%D-6869
Yellowness Index (YI)max. -1MCAMDE-313
Molded Bar Properties
ValueUnitsTest Method / Conditions
Tensile Modulus2,500/850MPaASTM D-638
Elongation at Break (Conditioned)min. 200%ASTM D-638
Tensile Strength at Yield77/38MPaASTM D-638
Elongation at Break (DAM)37%ASTM D-638
Flexural Strength105/33MPaASTM D-790
Flexural Modulus2,504/630MPaASTM D-790
Notched Izod Impact37/320J/mASTM D-256
HD (at 0.45 MPa)133 (271.4)°C (°F)ASTM D-648
HD (at 1.8 MPa)61 (141.8)°C (°F)ASTM D-648
Mold Shrink - MD (at 48 hrs)0.94%ASTM D-955
Mold Shrink - TD (48 hrs)1.03%ASTM D-955
Density1.11g/cm3ASTM D-792

Technical Details & Test Data

Typical Performance Comparison for Aegis® H55C2ZP (30% GF Reinforced Parts)
Items PA6 (H8202NLB) PA66 PA6/66 (H55C2ZP) Remarks
Surface Finish O + Aegis® H55C2ZP yields excellent surface finish for glass-filled molded parts
Warpage O + Significant improvement
Shrinkage O + Improved due to lower crystallinity
Toughness O + Aegis® H55C2ZP exhibits improved toughness in glass-filled applications in wet or dry conditions at normal or low temperatures.
Processability O + Aegis® H55C2ZP can be processed at lower melt temperatures which enables compounding with heat-sensitive additives with decreased degradation
Density O O O Similar
Strength O + Similar to baseline (DAM), ~ 10% lower (COND)
Modulus O + Similar to baseline (DAM),~ 15% lower (COND)
Thermal Resistance (HDT) O + O Similar to baseline

O = Baseline
DAM = Dry as Molded
COND = 2.7% H2 O

Packaging & Availability

Packaging Information

Aegis® H55C2ZP is a copolyamide compounding grade available today in commercial quantities, and can be supplied in either bag or Gaylord packaging. It is fully qualified in production on our flexible polymerization asset, as well as in downstream use.